Printed circuit board, prepared 2,54 mm, epoksy laminate (CEM3). Leadless solder on 35 µm copper foil
Printed circuit board for test purpose, epoksylaminate (FR4), 35 µm tinned, leadless foils
Printed circuit board for test purpose. Epoksy laminate (FR-4), 35 µm, tinned foils
Printed circuit board for many different surface mounted small components . Epoxy laminate (FR4) with chemically gold plated 35 μm copper foil. ...More info
Printed circuit board for test purpose with pads, Epoksy laminate (FR-4), 35 µm, leadless tinned foils
Printed circuit board with pads for 10 different surface mounted SO/SOJ circuits. Fits pole numbers (8-40). Epoxy laminate (FR4) . Gold plated 35 &...More info
Printed circuit board for 7 different surface mounted SSOP circuits. Fits different pole numbers (8-40) pin. Epoxy laminate (FR4) with chemically g...More info
Printed circuit board for 7 different surface mounted TSSOP circuits. Fits a large number of different pole numbers (8-56). Epoxy laminate (FR4) wi...More info
Printed circuit board for test purpose with links of phenol paper
1-sided printed circuit board for small production, FR-41,55 mm thick laminate, applied with positive photoresist Copper layer 35 &micr...More info
